IMX376 20MP MIPI Fixed Focus Sony Camera Module
video

IMX376 20MP MIPI Fixed Focus Sony Camera Module

Image Size :Diagonal 6.475 mm (Type 1/2.78)
Total Number Of Pixels:5216 (H)x4032(V) approx. 21.03 M pixels
Number Of Effective Pixels:5216 (H)x3896 (V)approx. 20.32 M pixels
Number Of Active Pixels:5184(H)x3880(V)approx. 20.11 M pixels
Chip Size:6.415 mm (H) x 4.759 mm (V)
Unit Cell Size:1.00 um (H) x 1.00 um (V)
High Frame Rate 120fps @2x2 Adjacent Pixel Binning (4:3)/150fps @2x2 Adjacent Pixel Binning (16:9) (TBD).
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Description

Technical Parameters

Product Introduction

IMX376 20MP MIPI Fixed Focus sony Camera Module is a diagonal 6.475 mm (Type 1/2.78) 20 Mega-pixel CMOS active pixel type stacked image sensor with asquare pixel array. It adopts Exmor RS TM technology to achieve high speed image capturing by column parallel A/Dconverter circuits and high sensitivity and low noise image (comparing with conventional CMOS image sensor)through the backside illuminated imaging pixel structure. R, G, and B pigment primary color mosaic fiter is employed . Supports OEM/ODM.

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Product Details

 

IMX376 20MP MIPI Fixed Focus sony Camera Module is suitable for a low-power camera module with a 2.8 V/1.8 V/1.05 V power supply.

● Image Size:Diagonal 6.475 mm (Type 1/2.78).

● Total Number Of Pixels:5216 (H)x4032(V) approx. 21.03 M pixels.

● Number Of Effective Pixels:5216 (H)x3896 (V)approx. 20.32 M pixels.

● Number Of Active Pixels:5184(H)x3880(V)approx. 20.11 M pixels.

● Chip Size:6.415 mm (H) x 4.759 mm (V).

● Unit Cell Size:1.00 um (H) x 1.00 um (V).

● High Frame Rate 120fps @2x2 Adjacent Pixel Binning (4:3)/150fps @2x2 Adjacent Pixel Binning (16:9) (TBD).

● Output video format of RAW10/8, COMP8.

● MIPI 2lane/4lane, Max. 2.3Gbps/lane.

● IMX376 20MP MIPI Fixed Focus sony Camera Module support.

 

Lens:Customizable for various scenarios. Autofocus/Fixed-focus optional. Supports OEM/ODM.

 

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